The 28th IEEE Electronic Design Process Symposium—virtual experience

Event Date: 4-5 November 2021
Location: Virtual

The Institute of Electrical and Electronics Engineers (IEEE) has announced the 2021 Electronic Design Process Symposium (EDPS). The EDPS will be virtual this year available over Zoom on November 4th and 5th.

In its 28th year, EDPS is a leading forum for thought leaders of the design community from industry participants as well as academia. EDPS encourages industry leaders to discuss state-of-the-art improvements to the electronic design processes and CAD methodologies, emphasizing trends and new paradigms, rather than on the functions of the individual tools themselves.

EDPS continues to expand its scope this year and will focus on Smart Design and Manufacturing. Talks and panel discussions will look at new developments in systems approach to design and manufacturing, and work using system-level techniques to reach HVM in a shorter amount of time. New techniques such as Silicon Photonics, Heterogeneous Integration, Advanced Packaging, and Machine Learning for improving design processes will also be presented.

Ramond Rodriguez of Intel will have the honor to serve as the general chair and will open the conference at 9 AM on the 4th of November. A few of the featured speakers will be Len Orlando from the Air Force Research Laboratory providing the USAF’s Perspective on the Application of Machine Learning for Microelectronics Design and Security. David Pellerin of Amazon Web Services speaking on Designing for Trust in a Zero-Trust World—Perspectives from the Cloud, plus others. A preliminary program to the symposium can be found HERE

Day 1 Speaker - Len Orland of the Air Force Research Laboratory


Register for the 28th IEEE Electronic Design Process Symposium on Zoom Events here.

The 2021 EDPS is sponsored by Intel, CEDA, Cadence, Synopsys, Ansys, and Siemens.

EDPS provides a vast archive of past papers and presentations, which can be accessed on its site