Celestial AI puts photonics in the middle of the chip

CEO tells us how and why.

August 27, 2025

David Harold

Celestial AI has introduced the Photonic Fabric Module, a claimed industry-first SoC with optical interconnect integrated directly in the middle of the die. By embedding thermally stable photonic I/O inside silicon, the company sidesteps the “beachfront” bottleneck of traditional SoC packaging. The design delivers up to 7.2 Tbps of optical connectivity in a compact 5nm multi-chip module and scales to appliances offering 32TB of unified memory—targeted squarely at AI and HPC workloads. Celestial AI, a start-up positioning itself as “the photonic fabric company,” has unveiled an authentic breakthrough in chip design: the first system-on-chip with optical interconnect embedded in the

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Celestial AI puts photonics in the middle of the chip

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