Intel scales up functionality and out physically

The largest multi-chip floor to date.

December 29, 2025

Jon Peddie

Intel Foundry recently shared a vision on X that reads like a peek into the next chapter of processor design. Instead of chasing bigger monolithic dies, Intel leans on packaging to scale systems to smartphone-sized footprints, nearly 12 times a single reticle. The idea stacks up to 16 14A compute tiles over eight 18A base dies, feeds them with as many as 24 HBM5 stacks, and links everything through dense 3D bonding and advanced bridges. The story now turns to power delivery, heat removal, and whether cooling can keep pace. (Source: Intel) In a recent X tweet, Intel Foundry outlined a packaging

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Intel scales up functionality and out physically

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