AMD’s big cache exposed at Hot Chips

AMD changed the rules when it introduced its chiplet packaging approach and demonstrated it could beat Amdahl’s Law and scale-up processors. At Hot Chips 2021, they revealed a bit more about their packaging magic, and their 3D V-Cache uses a novel new hybrid bonding technique. This manufacturing scheme can create up to an impressive 192 MB of L3 cache per CPU chip., At Computex, AMD showed a prototype Ryzen 5000 series processor with an additional 64 MB 7 nm SRAM stacked directly on top of the CPU core complex. When tested versus a stock 5900X at 4.0 GHz, they achieved