The MediaTek Dimensity 9400e is a high-performance mobile SoC built on TSMC’s 4 nm process, featuring an All Big Core CPU layout and a 12-core Immortalis-G720 GPU. It supports advanced AI via the NeuroPilot SDK, real-time gaming optimization through HyperEngine, and image processing with an 18-bit ISP. Designed for demanding tasks like AI inference, gaming, and 5G connectivity, it enables efficient operation under heavy workloads. The chipset also offers Wi-Fi 7, Bluetooth up to 5 km, and dual-SIM capabilities. Device launches are expected this cycle.
The MediaTek Dimensity 9400e is built using TSMC’s third-generation 4 nm process and features “All Big Core CPU architecture” as per the company. The chip is also integrated with a 12-core Immortalis-G720 GPU for enhanced graphics, suitable for gaming and performance-centric devices.
It features the MediaTek NPU 790 for generative AI, supporting various language models and the MediaTek NeuroPilot SDK for on-device AI applications.
The Dimensity 9400e is a new SoC designed for high-performance mobile applications in the premium segment. This processor extends MediaTek’s range of flagship-class mobile platforms, enabling greater architectural diversity for original equipment manufacturers seeking to integrate differentiated performance characteristics across various device categories. The Dimensity 9400e incorporates a heterogeneous CPU layout and an integrated GPU designed to address computationally intensive workloads, including those associated with artificial intelligence inference, advanced gaming applications, image processing, and next-generation wireless connectivity.
The Dimensity 9400e is fabricated using TSMC’s third-generation 4 nm process node and features a CPU cluster composed entirely of high-performance cores. The architecture includes four Arm Cortex-X4 cores, each capable of reaching frequencies up to 3.4 GHz, and four Arm Cortex-A720 cores operating at up to 2.0 GHz. This core configuration is intended to provide sustained computational throughput under high load conditions while maintaining thermal and energy parameters appropriate for mobile device constraints.
Graphics operations are handled by a 12-core Arm Immortalis-G720 GPU. This unit supports hardware-based mobile ray-tracing capabilities, including global illumination, which are designed to approximate the visual effects traditionally associated with desktop or console-class rendering pipelines. These features contribute to the chipset’s support for graphically demanding workloads and gaming scenarios, particularly those that leverage real-time lighting models.
In the context of gaming-specific optimization, the Dimensity 9400e integrates MediaTek’s HyperEngine suite. This includes Adaptive Gaming Technology (MAGT 2.0), a dynamic scheduling system that coordinates performance allocation between the application layer and the SoC in real time. The objective of this subsystem is to manage frame rate stability, while minimizing power consumption during interactive workloads. The chipset also includes support for MediaTek Frame Rate Converter (MFRC 2.0+), which provides frame interpolation and adaptive frame pacing mechanisms that reduce power draw during graphical rendering tasks by up to 40% in specific conditions.
The Dimensity 9400e supports MediaTek’s latest version of the NeuroPilot SDK, which facilitates the deployment of generative AI models on-device. Enhanced decoding functionality (SpD+) is included to optimize inference execution, particularly for transformer-based architectures. The platform is compatible with a variety of language model formats, including but not limited to DeepSeek-R1-Distill, Qwen1.5B, Llama-7B, Llama-8B, Gemini Nano with multimodal capability, and Llava-1.5-7B. These models can be operated directly on the device, eliminating the need for constant cloud interaction and enabling more immediate and context-aware user interactions.
Image signal processing capabilities are supported through an 18-bit RAW-capable ISP, which includes semantic segmentation across up to 16 distinct layers for video capture scenarios. The system can also perform high-dynamic-range noise reduction using input from a tri-microphone array. These functions are designed to improve the quality of media captured under varying lighting and acoustic conditions, aligning with use cases requiring higher fidelity in mobile content creation.
The Dimensity 9400e also integrates a comprehensive suite of wireless communication technologies. It supports sub-6 GHz 5G with four-carrier aggregation and theoretical downlink throughput up to 7 Gbps. Wi-Fi 7 compatibility enables tri-band concurrency with five simultaneous data streams, achieving peak transmission speeds up to 7.3 Gbps under ideal conditions. The SoC includes MediaTek’s UltraSave 3.0 power optimization framework for 5G, as well as support for multi-mode Dual SIM dDual Active (DSDA) operation. The Bluetooth subsystem is designed to support long-range device-to-device communication up to 5 km under line-of-sight conditions, depending on environmental and antenna configurations.
Initial commercial deployment of smartphones utilizing the Dimensity 9400e platform is scheduled to begin within the current product cycle.
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