(Source: AMD) During AMD’s CEO Lisa Su’s Computex keynote presentation, the rightfully proud president revealed AMD’s new secret weapon for improved performance of the company’s Zen processors. With TSMC’s help, AMD will bond the L3 cache directly to and on top of the Zen CPU via Vias (through-silicon vias—TSVs). In addition to the new 3D stacking approach, the size ...
TechWatch is the front line of JPR information gathering service, comprising current stories of interest to the graphics industry spanning the core areas of graphics hardware and software, workstations, gaming, and design.
A subscription to TechWatch includes 4 hours of consulting time to be used over the course of the subscription.
Already a subscriber? Login below