AMD’s big cache exposed at Hot Chips

AMD changed the rules when it introduced its chiplet packaging approach and demonstrated it could beat Amdahl’s Law and scale-up processors. At Hot Chips 2021, they revealed a bit more about their packaging magic, and their 3D V-Cache uses a novel new hybrid bonding technique. This manufacturing scheme can create up to an impressive 192 MB of L3 cache per ...

Jon Peddie

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