Apple’s M1 Ultra (2022)

In March 2022, at its annual new products conference, Apple announced a new version of the M1—the M1 Ultra, a dual-die chiplet device that introduced Apple’s UltraFusion interconnect technology. Apple’s UltraFusion packaging architecture connects two M1 Max die to create the M1 Ultra. (Source: Apple)   Apple’s UltraFusion used a silicon interposer to connect the chips across more than 10,000 signals, providing 2.5TB/s of low-latency and inter-processor bandwidth. That was four times more, claimed Apple, than the bandwidth of the leading multi-chip interconnect technology. Apple said the M1 Ultra would behave and be recognized by software as one chip, so