Chiplets need a home—UCIe has one for them

Universal Chiplet Interconnect Express (UCIe) is an open specification that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level. Forming an open industry standard organization around UCIe are Advanced Semiconductor Engineering (ASE), AMD, Arm, Google Cloud, Intel, Meta, Microsoft, Qualcomm, Samsung, and TSMC. The feasibility of implementing complex systems on monolithic dies is reaching its physical and economic limits. Gordon Moore predicted this “day of reckoning” in his seminal 1965 white paper, “Cramming More Components onto Integrated Circuits,” writing that as chip density and complexity progressed, eventually “it may