Getting stacked—BBCube 3D, a new semiconductor integration and data transmission construct

Stacking processor units on RAM without solder.

Jon Peddie

Researchers from Tokyo Tech have developed an advanced technology that enables the three-dimensional integration of processing units and memory, setting a new global benchmark for performance and revolutionizing the world of computing. Dubbed BBCube 3D, this cutting-edge stacked architecture not only achieves significantly higher data bandwidths compared to existing memory technologies, but it also minimizes the energy required for bit access. With its remarkable capabilities, BBCube 3D paves the way for faster and more efficient computing systems. Structural diagram of BBCube 3D. (Source: Tokyo Tech) Researchers from The Tokyo Institute of Technology have developed a new technology called BBCube 3D,

Enjoy full access with a TechWatch subscription!

TechWatch is the front line of JPR information gathering service, comprising current stories of interest to the graphics industry spanning the core areas of graphics hardware and software, workstations, gaming, and design.

A subscription to TechWatch includes 4 hours of consulting time to be used over the course of the subscription.

Already a subscriber? Login below

This content is restricted

Subscribe to TechWatch