Huawei’s Da Vinci AI accelerator explained at Hot Chips

  Announced at Hot Chips last year and again at the Shanghai Full link Conference, the Da Vinci AI accelerator has been making the rounds. Huawei provided more details at Hot Chips this year. The company said their plan is to scale their technology from inference on wearables to training for the data centers. A big part of the design is the use of 3D memory. Huawei will use a 3D SRAM cache   Heng Liao, an R&D manager of Huawei, gave a presentation by video. If you've read the news much at all, you know that travel is difficult and legally