Intel going to glass for substrates

Intel is looking to change the material of semiconductor substrates, with glass being considered superior to organic substrates due to its stiffness and lower coefficient ratio of thermal expansion. Glass substrates offer improved dimensional scaling and power delivery, enabling the extension of high-speed diodes. This transition will occur gradually alongside organic substrates, as tools, manufacturing processes, and needs emerge. Intel is aggressively transitioning its product lines to embedded multi-die interconnect bridge (EMIB) technology and exploring 3D interconnects for higher performance. Glass-based coupling with integrated waveguides is being developed for next-gen interconnects, and Foveros technology will continue to be enhanced. Intel