Intel launches hybrid notebook processor

Two and half years ago at an Intel Architecture Day event, Intel revealed its 3D packaging interconnect concept it call Foveros. It sounded intriguing then, but Intel didn’t have much more to say about afterwards. Intel said at the time that Foveros would pave the way for devices and systems combining high-performance, high-density and low-power silicon process technologies.  Foveros is a die stacking capability that replaces traditional passive interposers for stacked memory and high-performance logic, such as CPU, graphics, and AI processors. At the time Intel said it expected to launch a range of products using Foveros beginning in the