Intel’s 18A process node

2 angstroms (11%) smaller than 2 nm

June 23, 2025

Jon Peddie

Intel’s 18A process node combines RibbonFET transistors with PowerVia backside power delivery and Foveros 3D packaging. This architecture drives a fundamental shift from monolithic chips to modular systems built from stacked dies. By improving transistor efficiency, reducing power loss, and enabling heterogeneous integration, the 18A node delivers enhanced performance and design flexibility. It targets diverse applications including high-performance computing, AI, mobile, and aerospace systems, supported by a broad ecosystem to help designers adopt the new manufacturing and packaging landscape. Intel introduced its 18A process node as a new phase in semiconductor development, integrating RibbonFET gate-all-around transistors with PowerVia backside power delivery. Building

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Intel’s 18A process node

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