Intel’s embedded multi-die interconnect bridge

Most chips in today's smartphones, computers, and servers are comprised of multiple smaller chips invisibly sealed inside one rectangular package. How those multiple chips—often including CPU, graphics, memory, IO, and more—communicate has been a challenge for circuit, chip, and packaging designers? Intel thinks they’ve got the answer with their EMIB (embedded multi-die interconnect bridge) which is a complex multi-layered sliver of silicon no bigger than a grain of rice. It lets chips fling enormous quantities of data back and forth among adjoining chips at blinding speeds: several gigabytes per second. Before EMIB, designers used an interposer to connect multiple chips