Intel’s stacked chip is sexy

Image credit:  phee hawberries   Intel’s newest chip family, code-named Lakefield, is built with Intel’s Foveros technology. They are built in a totally new way, says Intel; not with the various IPs spread out flat in two dimensions, but with them stacked in three dimensions. Think of a chip designed as a layer cake (a 1-mm-thick layer cake) versus a ...

Jon Peddie

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