Intel’s stacked chip is sexy

Image credit:  phee hawberries   Intel’s newest chip family, code-named Lakefield, is built with Intel’s Foveros technology. They are built in a totally new way, says Intel; not with the various IPs spread out flat in two dimensions, but with them stacked in three dimensions. Think of a chip designed as a layer cake (a 1-mm-thick layer cake) versus a chip with a more-traditional pancake-like design. Intel’s Foveros advanced packaging technology allows Intel to mix and match technology IP blocks with various memory and I/O elements—all in a small physical package for significantly reduced board size. Intel's mobile client platform,