Samsung asks, how smart is your memory?

(Source: Samsung)   Samsung used the 2021 Hot Chips conference, thirty-third in the series, to further reveal and promote a novel alteration of how high-speed memory could be built with AI technology. Samsung’s revelations included the successful integration of its processing-in-memory (PIM)-enabled High Bandwidth Memory (HBM-PIM) into a commercialized accelerator system. That, said Samsung, would broaden PIM to include DRAM modules and mobile memory, and accelerate the convergence of memory and logic. At the ISSCC in February 2021, Samsung incorporated AI processing into its HBM2 Aquabolt and called it the HBM-PIM (code-named Aquabolt-XL). The HBM-PIM was tested in the Xilinx