Introduces 700 platform, a subset of 800 platform for IoT automotive and embedded
Qualcomm’s new 700 series is targeted at OEMs and the company claims it offers premium features, such as on-device artificial intelligence, in high-tier smartphones and can meet the ever-increasing demands of China’s smartphone ecosystem for more premium devices.
The new Qualcomm Snapdragon 700 Mobile Platform Series offers features and performance previously only available in the premium Snapdragon 800 Mobile Platform Series. Advances in the 700 Series include on-device AI supported by the Qualcomm Artificial Intelligence (AI) Engine, and improvements to camera, device performance and power, supported by the heterogeneous compute power of premium features including the Qualcomm Spectra ISP, Qualcomm Kryo CPU, Qualcomm Hexagon Vector Processor and Qualcomm Adreno Visual Processing subsystem.
The Snapdragon 700 Series products will come with the multi-core AI Engine delivering, up to 2x improvements for on-device AI applications compared to the Snapdragon 660 Mobile Platform, says Qualcomm. Through heterogeneous computing, the new architectures of the 700 Series—the Hexagon Vector Processor, Adreno Visual Processing subsystem, and Kryo CPU can be used to capture and share videos, learn voice and speech and make a device last on a single charge without changing applications or settings.
The Spectra ISP can capture in low-light and create slow-motion video with the help of AI. Qualcomm expects its OEM customers to exploit the platform and bring out devices with a multitude of additional professional grade camera features, supported by high-quality specs, to reside in the 700 Series.
The 700 Series will debut new architectures across the mobile platform which will offer up to 30% improvements in power efficiency, and better performance and battery life across numerous applications compared to the Snapdragon 660 Mobile Platform. 700 Series products will also employ Quick Charge 4+ technology, engineered to get up to 50% charge in only 15 minutes.
The Snapdragon 700 Tier will also feature an advanced suite of wireless technologies with ultra-fast LTE, carrier Wi-Fi features, as well as enhanced Bluetooth 5.
Commercial samples of the first Snapdragon 700 Series Mobile Platforms are anticipated to ship to customers 1H 2018.