Intel Q4 2022 and FY 2022 financial results
Sales down, forecast down; Q4 revenue $14.0 billion, down 32% YoY
Intel Q4 2022 and FY 2022 financial results
Sales down, forecast down; Q4 revenue $14.0 billion, down 32% YoY
Was 2022 the year of the GPU?
Maybe, it was certainly an active year.
Intel splits graphics group
Market segmentation trumps scalability.
Mt. Tiburon Testing: The Intel Arc A700 arrives and acquits itself handily
The new board series nestles comfortably between AMD RX 6600XT and Nvidia RTX 3070
Optimizing performance: Does Resizable BAR help?
Yes, but it is game dependent—we tested with Intel AIB
Intel maxes their data center GPUs
New branding for high-end chips and AIBs
GPUs are damn tricky
Intel is finding out just how tricky they can be!
Not your father’s computer display
Over the years, we’ve seen an evolution in electronic computer displays in terms of shapes and sizes. From basic CRTs, to plasmas and LCDs, to LEDs, OLEDs, and more. From large, heavy devices to lightweight flat panels. From low-resolution screens of 320×200 to those of high dynamic range and resolutions of 3840×2160. From slim models, to those that swivel, lean, … Read more
Intel’s wonderful Flex AIBs
(Source: Intel) A few weeks ago, Intel rebranded the Artic Sound-M data center GPU as the Flex series. The first products introduced are the Flex Series 170 and 140—how wonderful is that? The name change was made almost the same time Intel launched its new slogan campaign, How Wonderful Is That? Intel’s new campaign. (Source: Intel) The Flex 170 and … Read more
Chiplets need a home—UCIe has one for them
Intel creates a universal interconnect consortium
Chiplets need a home—UCIe has one for them
Universal Chiplet Interconnect Express (UCIe) is an open specification that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level. Forming an open industry standard organization around UCIe are Advanced Semiconductor Engineering (ASE), AMD, Arm, Google Cloud, Intel, Meta, Microsoft, Qualcomm, Samsung, and TSMC. The feasibility of implementing complex systems … Read more